The MAR ENAU TH 10 process is a new generation through hole system formulated to be used in the ENIG process.
The MAR ENAU TH 10 utilizes a blend of acids and surfactants which renders the palladium activated through-hole none active to further processing in an Electroless Nickel Immersion Gold process.
The MAR ENAU TH 10 system removes light oils, oxides and fingerprints on the copper surface leaving a very bright and active substrate for further processing.
The MAR ENAU TH 10 system has a very low surface tension characteristic allowing excellent wetting of all copper surfaces and through-hole. This allows easy rinsing of the boards.
The outstanding features of the MAR ENAU TH 10 process is:
|ENAU TH 10A||10 % BV||8 – 12 % BV|
|ENAU TH 10B||5 % BV||4 – 6 % BV|
|Temperature||90 °F||80 – 95 °F|
|Time||5 minutes||3 – 5 minutes|
|MAR ENAU TH 10A||10 % BV|
|MAR ENAU TH 10B||5 % BV|
The pH must be maintained < 1.0 for maximum effectiveness.
Periodic addition of both ENAU TH 10A & ENAU TH 10B should be made after analysis of the ENAU TH 10A. Additions must be 2 parts ENAU TH 10A to 1 part ENAU TH 10B.
The solution should be dumped after processing 25 ssf of board per LITRE of made up solution MAR ENAU TH 10.
|TANKS||Polypropylene, PVC, Polyethylene or fiberglass.|
|HEATERS||PTFE, quarts, 316 SS of titanium.|
|VENTILATION||Advises at 50 fpm.|
|FILTRATION||Recommended filtration through a 25 micron polypropylene cartridge.|
|AGITATION||Solution movement of 4 -5 solution turnovers per hour and rocker agitation of 6 inches per minute.|