Electroless Nickel


ENDEP 11 is an electroless nickel plating process formulated to deposit a semi-bright to bright, high phosphorus – nickel alloy exhibiting high intrinsic corrosion resistance .

ENDEP 11 is capable of deposition rates 0.3 to 0.5 mils per hour without sacrificing bath stability. Optimum phosphorus levels of 10 to 12 are usually obtained at plating rates of 0.3 – 0.5 mils producing optimum corrosion resistant deposits.

ENDEP 11 is supplied as a three-component liquid system. ENDEP 11 A and ENDEP 11 B are only used for bath make-up. The bath concentration is maintained with ENDEP 11 A and ENDEP 11 C.

Advantages of the ENDEP 11 process include:

  • Consistent deposition rate throughout the life of the bath.
  • Unique stabilizer chemistry provides for long stable bath life.
  • Economical to operate with 7 – 8 metal turnovers.
  • Non-magnetic coating.
  • Freedom from porosity resulting in excellent wear resistance and corrosion resistance.
  • The applied deposit is compressively stressed.
  • Self-polishing effect in molding operations
  • Also suitable in the oil and gas environment, aerospace and printing industries

WARRANTY AND DISCLAIMER: This information is based on our experience and is, to the best of our knowledge, true and accurate. MAR-Tech Holdings Inc. gives no warranty, expressed or implied and the products are sold upon condition that the purchasers will make their own tests to determine the quality and suitability of the product. Any information or suggestions are given without warranty of any kind and the purchasers are solely responsible any loss arising from the use of such information.


Phosphorus Content Range 10 - 12 (wt. %)
Melting Range: 880 °C (1620°F)
Hardness 450 Knoop Hardness
Magnetic Properties (Coactivity): Non-Magnetic
Nitric Acid Test: Pass
Hydrochloric Acid Test Pass
Colour: Semi bright
Hardness (as plated) 480 - 520 Vickers
Wear Properties (as plated)
Taber Index Value 15 – 18 mg/1000 cycles loss
Corrosion Properties 1000+ hrs. Salt Spray Test ASTM B117
Solution Make-up:
ENDEP 11 A 6.0% by volume
ENDEP 11 B 18% by volume
Deionized Water To operating volume
  1. Fill tank to one-half its final volume with distilled or deionized water.
  2. Add ENDEP 11 B followed by the ENDEP 11 A and mix well.
  3. Add water to final volume, mix well and heat to 188 °F.
  4. Analyze the nickel content and adjust to 6 g/l if necessary.
  5. Adjust pH, as required, to be in operating range of 4.8 by carefully adding ammonium hydroxide to raise pH and 20% by volume Sulphuric acid to lower pH.
Solution Maintenance

Bath Replenishment

To ensure proper operation of the ENDEP 11 system, the solution chemistry must be maintained between 85% and 105% of initial activity. This is accomplished by measuring and monitoring the nickel metal concentration via a standard EDTA titration.

The ENDEP SYSTEM is designed to be replenished in a 1:1 of the 11A and 11C.

Upon determination of the nickel metal concentration, additions of both ENDEP 11 A and ENDEP 11 C or ENDEP 11 D are made based on the following calculation and/or replenishment guide.

Replenishment Calculation:

To increase the nickel content by 1 g/l, add 1 litre of ENDEP 11 A per 100 litres of plating solution.

To increase the reducer content by 1 g/l, add 2ml/ litre of ENDEP 11 C.

The ENDEP 11 D is designed as a self regulating pH system and to raise the reducer by 1 g/l, an addition of 2 ml/litres of ENDEP 11 D.

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