The Atotech Sulfamate Nickel Plating Process produces deposits that are particularly suitable to engineering and functional uses. The bath can be controlled to obtain consistent deposits over a wide range of stress, hardness, tensile strength, and ductility.

Characteristics of the Atotech Sulfamate Nickel Plating Process and its deposits include:

  • Deposit properties (e.g., hardness, tensile strength) can be altered to meet various specs.
  • Excellent deposit ductility with controllable internal stress (compressive or tensile).
  • Good bath tolerance to impurities.
  • Ease of solution purification - continuous filtration through activated carbon and continuous electrolytic purification are possible.
  • Wide current density range allows fast plating rates.
  • Complete analytical control of all bath constituents.
  • Bath chemistry is stabile over long periods of operation.
  • Heavier, more ductile deposits are possible without build-up of trees and nodules.
For Still or Barrel Plating Optimum Range
Electropure 24 Nickel Sulfamate 55 fl.oz./gal (427 ml/l) 38 - 67 fl./gal (294 - 522 ml/l)
NiCl2 . 6H2O 0.8 oz/gal (6 g/l) 0.8 - 4.0 oz/gal (6 - 30 g/l)
Boric Acid 5 oz/gal (37.5 g/l) 4 - 6 oz/gal (30 - 45 g/l)
SN-1 Addition Agent 1.5 oz/gal (11 g/l) 0 - 1.5 oz/gal (0 - 11 g/l)
Anti-Pit No. 12 (cathode agitation) 0.15% by vol. (1.5 ml/l) 0.1 - 0.3% by vol. (1 - 3 ml/l)
Anti-Pit Y-17 (air agitation) 0.15% by vol. (1.5 ml/l) 0.1 - 0.3% by vol. (1 - 3 ml/l)

The solution is prepared in either a storage tank or the plating tank. All loose dirt, grease, etc. should be wiped off the tank and the sides and bottom scrubbed with a detergent in hot water then thoroughly rinsed. The tank linings and all auxiliary equipment should be leached for 12 hours with a 2 to 5% by volume solution of sulfuric acid heated to 140° F (60° C) and then rinsed thoroughly.

  1. Fill tank to slightly less than one-half of its final volume with water and heat to 150° F (66° C).
  2. Add the required amount of boric acid and agitate until it is dissolved.
  3. Next, add and dissolve the required amount of nickel chloride (NiCl2 •6 H2O).
  4. Add the required amount of Electropure 24 Nickel Sulfamate.
  5. Add the required amount of AP-12 or Y-17 wetting agent and bring solution to final volume with water. If the solution was made in a spare tank, filter into the plating tank. Adjust the pH to 3.5 - 4.2 (electrometric) with Nickel Sulfamate pH Controller, if necessary.
  6. Add the SN-1 addition agent, if it is to be used. The SN-1 should be dissolved in warm water and added to the plating tank through the filter that has been previously coated with filter aid and carbon.
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