PCB

MAR ENDEP 12

ENAU 12 is an electroless nickel plating process formulated to deposit a semi-bright to bright, high phosphorus – nickel alloy exhibiting high intrinsic corrosion resistance.

ENAU 12 is an electroless nickel plating process formulated to deposit a semi-bright to bright, high phosphorus – nickel alloy exhibiting high intrinsic corrosion resistance.

ENAU 12 is supplied as a three-component liquid system. ENAU 12-A and ENAU 12-B are only used for bath make-up. The bath concentration is maintained with ENAU 12-A and ENAU 12-C.

Advantages of the ENAU 12 process include:

  • Consistent deposition rate throughout the life of the bath.
  • Unique stabilizer chemistry provides for long stable bath life.
  • Economical to operate with 7 – 8 metal turnovers.
  • Non-magnetic coating.
  • Freedom from porosity resulting in excellent wear resistance and corrosion resistance.
  • The applied deposit is compressively stressed.
DEPOSIT PROPERTIES
Phosphorus Content Range 10 - 12 (wt. %)
Melting Range: 880°C (1620°F)
Hardness 450 Knoop Hardness
Magnetic Properties (Coactivity): Non-Magnetic
Nitric Acid Test: Pass
Hydrochloric Acid Test Pass
Colour Semi bright to Bright
Hardness (as plated) 610- 630 Vickers
SOLUTION MAKEUP

ENAU 12-A 6.0 % by volume

ENAU 12-B 18 % by volume

Deionized water To operating volume

  1. Fill tank to one-half its final volume with distilled or deionized water.
  2. Add ENAU 12-B followed by the ENAU 12-A and mix well.
  3. Add water to final volume, mix well and heat to 188 oF.
  4. Analyze the nickel content and adjust to 6 g/l if necessary.
  5. Adjust pH, as required, to be in operating range of 4.8 by carefully adding ammonium hydroxide to raise pH and 20% by volume Sulphuric acid to lower pH.
OPERATING PARAMETERS
Range Optimum
Nickel Concentration: 5.5 to 6.5 g/litre 6.0 g/litre
Sodium Hypophosphite 18 – 22 g/l 20 g/l
pH: 4.6 to 5.2 4.9
Operating Temperature: 85°C to 89°C 86°C
Bath Loading: 0.2 to 1.0 ft2/gal 0.5 ft2/gal
Plating Rate: 0.4 to 0.6 mils/hr 0.4 mils/hr

pH can be adjusted up with a 50% solution of ammonium hydroxide or potassium carbonate solution. Sulfuric acid, 10% by volume can be used to lower pH.

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